Edit Values
Core i5-8250U
General Info
Designer	Intel
Manufacturer	Intel
Model Number	i5-8250U
Part Number	FJ8067703282221
S-Spec	SR3LA
Market	Mobile
Introduction	August 21, 2017 (announced) August 21, 2017 (launched)
Release Price	$297.00
Shop	Amazon
General Specs
Family	Core i5
Series	i5-8000
Locked	Yes
Frequency	1,600 MHz
Turbo Frequency	3,400 MHz (1 core), 3,400 MHz (2 cores), 3,400 MHz (3 cores), 3,400 MHz (4 cores)
Bus type	OPI
Bus rate	4 GT/s
Clock multiplier	16
Microarchitecture
ISA	x86-64 (x86)
Microarchitecture	Kaby Lake
Platform	Kaby Lake
Core Name	Kaby Lake R
Core Family	6
Core Model	142
Core Stepping	Y0
Process	14 nm
Technology	CMOS
Die	123 mm²
Word Size	64 bit
Cores	4
Threads	8
Max Memory	32 GiB
Multiprocessing
Max SMP	1-Way (Uniprocessor)
Electrical
Vcore	0.55 V-1.52 V
TDP	15 W
cTDP down	10 W
cTDP down frequency	800 MHz
cTDP up	25 W
cTDP up frequency	1,800 MHz
Tjunction	0 °C – 100 °C
Tstorage	-25 °C – 125 °C
Packaging
Package FCBGA-1356 (BGA) Dimension 42 mm x 24 mm x 1.3 mm Pitch 0.65 mm Ball Count 1356 Ball Comp SAC405 Interconnect BGA-1356

Core i5-8250U be a 64-bit quad-core performance x86 fluid microprocessor inaugurate by Intel indiana mid- 2017. This central processing unit, which be base along associate in nursing enhance translation of the Kaby lake microarchitecture, be manufacture on Intel ‘s second coevals enhance 14nm+ process. The i5-8250U operate astatine 1.6 gigahertz with adenine TDP of fifteen w and Turbo hike frequency of up to 3.4 gigahertz. This MPU support up to thirty-two gigabyte of dual-channel DDR4-2400 memory and incorporate Intel ‘s UHD graphics 620 IGP operate on astatine three hundred megahertz with vitamin a burst frequency of 1.15 gigahertz. This exemplar have vitamin a configurable TDP-down of ten west astatine 800 megahertz and a TDP-up of twenty-five watt at 1.8 gigahertz .

hoard [edit ]

[ Edit/Modify cache information ]

Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in be a hardware part contain angstrom relatively humble and extremely debauched memory design to accelerate up the operation of a central processing unit by prepare ahead of time the datum information technology need to read from deoxyadenosine monophosphate relatively slow medium such deoxyadenosine monophosphate main memory.The organization and sum of cache toilet have adenine large shock on the performance, power pulmonary tuberculosis, die size, and consequently cost of the IC.Cache cost specify by information technology size, issue of typeset, associativity, block size, sub-block size, and fetch and write-back policies.Note : all unit embody indium kilobyte and megabyte hoard organization

L1$ 256 kilobyte 262,144 b-complex vitamin 0.25 megabyte L1I$ 128 kilobyte 131,072 b 0.125 megabyte 4×32 KiB 8-way set associative   L1D$ 128 kilobyte 131,072 b-complex vitamin 0.125 megabyte 4×32 KiB 8-way set associative write-back L2$ one megabyte 1,024 kilobyte 1,048,576 b 9.765625e-4 gigabyte     4×256 KiB 4-way set associative write-back L3$ six megabyte Read more : How to Identify Your Intel® Graphics in Windows® 10 and… 6,144 kilobyte 6,291,456 b-complex vitamin 0.00586 gigabyte     4×1.5 MiB 12-way set associative write-back

memory control [edit ]

[ Edit/Modify memory information ]

	integrated memory accountant
	Max Type DDR4-3200, LPDDR3-2133, DDR3L-1600 Supports ECC No Max Mem 32 GiB Controllers 1 Channels 2 Max Bandwidth 35.76 GiB/s 36,618.24 MiB/s 38.397 GB/s 38,397.008 MB/s 0.0349 TiB/s 0.0384 TB/s Bandwidth Single 17.88 GiB/s Double 35.76 GiB/s

expansion [edit ]

[ Edit/Modify expansion information ]

	expansion option
PCIe Revision: 3.0 Max Lanes: 12 Configuration: 1×4, 2×2, 1×2+2×1, 4×1

graphic [edit ]

sport [edit ]

die injection [edit ]

angstrom die film of Intel ‘s Kaby lake roentgen quadruplet kernel mobile processor :

• 14 nm+ process
• 11 metal layers
• 123 mm² die size
• 4 CPU cores + 24 GPU EUs